IEEE | ANDESCON is the biannual Technical and ScientificConference of the Andean Council of the IEEE that bringstogether IEEE professionals and scientists from the Andeancountries.
The ninth edition of this IEEE event will be held in the wonderful city of Santiago de Cali in Colombia. The slogan "Technology and Innovation for Andean Industry" defines the objective of this edition The ANDESCON conference is an opportunity for professional members, academics, researchers and industrialists to will meet and present the developments and technological advances that move the Andean region countries.
TOPICS ANDESCON 2018 The conference will cover novel technical developments, and offer tutorial overviews on topics as such, but not limited to:
IMPORTANT DATES Full Paper Submission Deadline: May 8th Notification of Acceptance Data: June 15th Final Paper Submission Deadline: July 13th
PAPER SUBMISSION The articles must be submitted in digital format (PDF) through the paper submission page. Papers could be written in English or Spanish, titles and abstracts must be only in English. Papers must use the IEEE conference format. The maximum length is six (6) pages per article including illustrations and references. Each paper should indicate appropriateness for the scope of the Conference, originality and quality of the technical content, whole organization and writing style. All accepted papers presented at the conference will be submitted for publication to IEEE Xplore. Authors of accepted papers must register for the Conference and attend to present their papers.
The submission Web page for ANDESCON 2018 is https://easychair.org/conferences/?conf=andescon2018 Contact Info: [email protected]
COMMITTEE General Chair: Faruk Fonthal Technical Program Chair: Yuri Ulianov Lopez Publication Chair: Enrique Ciro Quispe Local Arrangements: Hugo Andrés Macias Universidad Autonoma de Occidente Financial: Diana Briceño Universidad Distrital
El IEEE (The Institute of Electrical and Electronics Engineers, Inc.) creado en Nueva York en 1884, es una asociación internacional sin ánimo de lucro con sede principal en la ciudad de Piscataway en los Estados Unidos y subsedes en más de 190 países del mundo, con alrededor de 370.000 miembros, entre profesionales y estudiantes de ingeniería, diseño, derecho, administración, medicina, biología, diseño y ciencias afines.